Enabling the Industrial Internet – GE Technologies in Advanced Packaging and MEMS

Wednesday, May 28, 2014, 2:00 PM – 3:30 PM (Swan Hotel conference rooms)
ITherm and ECTC Attendees invited — no add’l cost

General Electric spends over $5B every year on innovation. That investment is the lifeblood of the company, and is made across a wide variety of industrial businesses that are trying to solve big problems. These problems affect all of us, whether it’s the cost of health care, bringing emerging nations modern energy and water infrastructure, or reducing the worldwide carbon footprint. Many of the problems will require looking at problems a different way. At GE Global Research, with thousands of material scientists, mechanical engineers, physicists, & chemists, and a deep understanding of systems, we tend to look at these problems from a different perspective; taking a 360-degree view around all aspects of a problem and coming up with unique and innovative solutions. Much progress has been made over the past 50 years in terms of materials, electronics and computing technologies, however the 21st century will drive us to new levels of integration and efficiency that will not yield to traditional, incremental improvements. In this talk, focus will be given on examples of engineering practices and solutions coming out of General Electric which will enable the growth and development of the industrial internet. It will address the challenges faced by Mechanical, Electrical and Systems Engineers that are searching for new ways to miniaturize their products, improve the efficiency & performance, and most importantly, keep driving down costs. Unique solutions around materials, packaging, MEMS, and thermal management will be presented to show how GE is trying to address some of the biggest challenges for the 21st century as identified by the National Academy of Engineering.

GiovannielloChris Giovanniello is VP Business Development for the GE Ventures Licensing organization. He is focused on building partnerships to commercialize GE technologies in the area of microelectronics and thermal management. Prior to joining GE, Chris spent 18 years in the semiconductor test industry at Teradyne.
TuominenRisto Tuominen is GE consultant and former CEO and founder of Imbera Electronics which was acquired by GE in 2013. Risto obtained his M.SC from Helsinki University of Technology. Prior to Imbera, he worked in Aspocomp Group oyj.
KeimelDr Chris Keimel has been a Process Development Engineer at GE’s Global Research Center for the past 10 years. He helped start and currently leads GE’s Metal MEMS technology efforts. In addition, his research extends beyond the MEMS field and includes sensors, nanofabrication, nano-scale electron based devices, NEMS, block co-polymer lithography, and imprint lithography. He has 16 granted patents, most in the MEMS field. He has given 6 invited talks in recent years on Metal MEMS and teaches a MEMS course as part of GE’s Advanced Course in Engineering. Chris has also organized symposiums on MEMS as part of the Materials Research Society conference.
GowdaDr Arun Gowda leads the Electronics Packaging and Miniaturization group at GE Global Research, responsible for developing advanced packaging and subsystem integration for GE’s diverse applications, including Aviation, Healthcare, and Energy. Previous to this role, Arun was a Senior Mechanical Engineer at GE Global Research and led research projects in the area of advanced power packaging and thermal management. Arun graduated from Binghamton University with a M.S and Ph.D. from the System Science and Industrial Engineering Department, specializing in Electronics Packaging, in 2001 and 2004 respectively. Arun has over 30 publications, fifteen issued patents and more than fifteen pending patent applications. Arun is a Six Sigma Black Belt and a TRIZ Level 3 Practitioner. He is also a visiting professor in the System Science and Industrial Engineering Department at Binghamton University.
Refai-AhmedDr Gamal Refai-Ahmed is Senior Technology Architect with GE Global Research Center and Adjunct Professor in Watson School of Engineering and Applied Science SUNY Binghamton and Department of Mechanical Engineering, University of. Prior to GE, he was the AMD Fellow. Dr. Refai-Ahmed obtained his B. Sc. and M. Sc. degrees from Alexandria University. He obtained the M. A. SC. and Ph. D. degrees in Mechanical Engineering from the University of Waterloo. Dr. Refai has made important contributions to the electronics packaging. He has significantly advanced this scientific field through his development of ground-breaking electronics cooling technologies. Dr. Refai is Associate Editor of Journal Components and Packaging, IEEE and Journal of Electronic Packaging, Transactions of the ASME. Gamal is the recipient of 2008 excellent thermal management award, 2010 best Associate Editor J Electronics Packaging, 2010 Calvin Lecture and 2013 K16- Clock award and 2014 IEEE Canada R.H.Tanner Industry Leadership Medal in recognition for his scientific contributions and leadership of promoting best electronics packaging engineering practice.