The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 30 – June 2, 2017 • Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista (Orlando), FL USA
(Co-Located with ECTC)

Please download the 2017 Call for Papers/Abstracts today.  
You may submit an abstract or paper from our Author Center

Sponsored by the IEEE’s CPMT Society and of course TFIA, ITherm 2017 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2017 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount.  In addition to Oral and poster presentations and vendor exhibits, ITherm 2017 includes panel discussions, keynote lectures by prominent speakers, Technical Talks, a Student Poster and Networking Session, and professional short courses.

We invite you to register for ITherm 2017. You may register on our Cvent website, which opens in December. More details on our Registration Page.

View the
Advance Program for 2016 (last year)
Our Sponsors for 2016: Binghamton University, Hard Drive Recovery Group, Microsanj, IBM, Huawei, and Intel
Joint ITherm/ECTC Professional Development Courses
Our Exhibitors for 2016: Long Win Science & Technology, TMX Scientific, Inc., ANSYS Corp, Staubli North America, Innovative Research, LLC, Quantum Focus Instruments, World Scientific Publishing

Important Dates:

Abstract Submission Deadline August 25, 2016
Notification of Acceptance September 30, 2016
Draft Student-Grant paper Due December 20, 2016
Draft paper Due December 20, 2016
Paper Reviews Returned by February 6, 2017
Final Version of Paper Due March 13, 2017
Author Registration Due March 13, 2017
Hotel Registration Deadline May 1, 2017
Earlybird Registration Deadline May 5, 2017
Conference May 30 – June 2, 2017

To receive periodic announcements about ITHERM, please join our IEEE ListServ Dlist.     You may also join by email:[email protected] with this information in the BODY:     subscribe   ieee-itherm  FirstName   LastName.

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