Conference Organizing Committee
General Chair: Dr. Madhusudan Iyengar, Google
Technical Program Chair: Dr. Michael Ohadi, University of Maryland
Thermal Management: Chair Thomas Brunschwiler, PhD, IBM Corp; Co-chair Saurabh Shrivastava, PhD, Panduit Corp; Co-chair Mike Ellsworth, IBM Corp.
Mechanics: Chair Kaustubh Nagarkar, General Electric, Jin Yang, Intel, Kaushik Mysore, Advanced Micro Devices, Ricky Lee, Hong Kong University of Science and Technology
Emerging Technologies: Chair Dr. Ashish Gupta, Intel Corporation; Co-Chair: Prof. Amy Marconnet, Purdue University; Co-Chair: Dr. Vadim Gektin, Futurewei Technologies; Co-Chair: Prof. Patrick McCluskey, University of Maryland
Student Poster and Networking Session: Chair: Milnes P David, IBM; Co-chairs: Parisa Foroughi, Dell; Amir Shooshtari, Univ. of Maryland; Jaeho Lee, UC Irvine.
Panels Track: Co-chair Victor Chiriac, Qualcomm; Co-chair Y.C. Lee, University of Colorado;
Tutorials Committee: Dr. Gamal Refai-Ahmed, PhD, GE Global Research; Mehdi Asheghi, PhD, Stanford University
Tech Talk Sessions: Karl Geisler, 3M, and Mike Ellsworth, IBM
Artistic Chair: Disha Bora, Anveshak; Co-chair: Darin Sharar, Army Research Lab
Entertainment & A/V Logistics Chair: Dr. Pritish Parida, IBM.
Sponsorship & Exhibits Committee: Sandeep Tonapi, PhD, Anveshak; Dr. Mehdi Asheghi, Stanford University.
Treasurer: Dustin Demetriou, IBM Corp.
Administration Chair: Paul Wesling, HP (retired)
Publications Chair: Paul Wesling, HP (retired)