The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 31 – June 3, 2016 • Cosmopolitan Hotel, Las Vegas, NV, USA
(Co-Located with ECTC)

Please download the Full Advance Program or the Advance Technical Program today.   Registration is now open; once you are registered, we can provide a Visa Interview letter, to assist in your travels to the USA.

Sponsored by the IEEE’s CPMT Society, ITherm 2016 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount.  In addition to Oral and poster presentations and vendor exhibits, ITherm 2016 includes panel discussions, keynote lectures by prominent speakers, a “Cutting Edge Vendors” session, a Workshop on the Industrial Internet, and professional short courses.

We invite you to register for ITherm 2016. You may register on our Cvent website, www.cvent.com/d/2fq1ck, now open. More details on our Registration Page.

View the
Advance Program for 2016
Download the Advance Technical Program for 2016
Joint ITherm/ECTC
Professional Development Courses
Our Sponsors: Binghamton University, Microsanj, IBM, Huawei, and Ozyegin University
Panels on critical topics: Mobile, Materials, Systems, 3D, Data Centers
Technology/Science Update Talks: Embedded Cooling, Liquid Cooling, Mobile, Power Electronics, Fluid Transport
Workshop: Enabling
the Industrial Internet
Become an ITherm Sponsor

Important Dates:

Abstract Submission Deadline September 4 September 30, 2015
Notification of Acceptance October 2, 2015
Draft Student-Grant paper Due December 4, 2015
Draft paper Due December 31, 2015
Final Version of Paper Due March 14, 2016
Author Registration Due March 28, 2016
Hotel Registration Deadline May 1, 2016
Earlybird Registration Deadline May 5, 2016
Conference May 31 – June 3, 2016

|   IEEE Privacy & Opting Out of Cookies   |   Nondiscrimination Policy