The Advance Program is now available for download and review. Please use one of the following links:
Full Advance Program (Version 4.2, May 12, PDF)
Listed below are the titles of the sessions:
THERMAL MANAGEMENT TRACK
- Power Electronics/Photovoltaics
- MCM/3D Packaging
- LEDs
- 3D Embedded Cooling/Mobile
- RF Electronics/Extreme Hot Spots
- Data Center – Control/Thermal Storage
- Data Center – Efficiency I & II
- Data Center – Air Cooling
- Data Center – Containment
- Heat Spreaders
- TIMs/PCMs
- Thermal Interface Materials & Characterization
- Heat Pipes/Vapor Chamber
- Thermosyphon/Vapor Chamber
- Air Cooling/Heat Sinks
- Thermoelectrics
- Modeling/Optimization
- Characterization/Instrumentation
- Single-Phase Convection & Cold Plates
- Two-Phase Convection I & II
- Condensation
- Pool Boiling/Jet Cooling
MECHANICS TRACK
- Solder Characterization & Modeling I & II
- Integrated Structures And Materials I & II
- Finite Element Analysis Techniques
- Mechanics For 3D Packaging
- Applied Reliability
- Solder Reliability
- Interconnect Technology
EMERGING TECHNOLOGIES TRACK
- Advanced Thermal Packaging I & II
- Advanced Experimental & Numerical Methods I & II
- Automotive/LEDs
- Heat Spreaders/Heat Pipe/Heat Exchangers/Pumps
- MEMS
- Microchannels
- Immersion Cooling
- Mobile
- Nanotechnology I & II
- Phase Change/Jets/Boiling
- Refrigeration/Thermoelectrics
- Thermal Transport
- Transistor TechnologyOther program elements:
Professional Development Courses on Tuesday, May 31, 2016
Student Poster and Networking Session on Thursday evening, June 2, 2016