Program

The Advance Program is now available for download and review. Please use one of the following links:

Full Advance Program (Version 4.2, May 12, PDF)

Listed below are the titles of the sessions:

THERMAL MANAGEMENT TRACK

  • Power Electronics/Photovoltaics
  • MCM/3D Packaging
  • LEDs
  • 3D Embedded Cooling/Mobile
  • RF Electronics/Extreme Hot Spots
  • Data Center – Control/Thermal Storage
  • Data Center – Efficiency I & II
  • Data Center – Air Cooling
  • Data Center – Containment
  • Heat Spreaders
  • TIMs/PCMs
  • Thermal Interface Materials & Characterization
  • Heat Pipes/Vapor Chamber
  • Thermosyphon/Vapor Chamber
  • Air Cooling/Heat Sinks
  • Thermoelectrics
  • Modeling/Optimization
  • Characterization/Instrumentation
  • Single-Phase Convection & Cold Plates
  • Two-Phase Convection I & II
  • Condensation
  • Pool Boiling/Jet Cooling

MECHANICS TRACK

  • Solder Characterization & Modeling I & II
  • Integrated Structures And Materials I & II
  • Finite Element Analysis Techniques
  • Mechanics For 3D Packaging
  • Applied Reliability
  • Solder Reliability
  • Interconnect Technology

EMERGING TECHNOLOGIES TRACK

  • Advanced Thermal Packaging I & II
  • Advanced Experimental & Numerical Methods I & II
  • Automotive/LEDs
  • Heat Spreaders/Heat Pipe/Heat Exchangers/Pumps
  • MEMS
  • Microchannels
  • Immersion Cooling
  • Mobile
  • Nanotechnology I & II
  • Phase Change/Jets/Boiling
  • Refrigeration/Thermoelectrics
  • Thermal Transport
  • Transistor TechnologyOther program elements:

Professional Development Courses on Tuesday, May 31, 2016
Student Poster and Networking Session on Thursday evening, June 2, 2016