ITherm Sponsors and Exhibitors

Opportunities for Contributors

ITherm provides an opportunity for industrial and university participation in the form of financial support to ITherm 2016. Donations can be made to support the overall conference itself, for supporting specific events, and support for student travel grants. All contributors will be given strong recognition both onsite and in the conference materials.

To discuss opportunities for supporting ITherm, please contact  Mehdi Asheghi, +1-650-725-2086.

Become a Sponsor for ITherm 2016 in Las Vegas!

Gold Sponsor: $5,000 +

    • 6’ table to distribute flyers/materials in the Foyer
    • 2 Complimentary Registrations to the ITherm conference
    • Access to student resumes participating in the student poster competition
    • 1 Full Page Acknowledgment as a Gold Sponsor in the Final Program
    • 2 Pages of promotional materials distributed at registration and integrated into the USB stick Proceedings, with a link to your corporate website
    • Acknowledgment on the conference website with a link to your corporate website
    • Signage throughout the conference venue acknowledging you as a Gold sponsor. Specific areas include: Hotel Lobby, Registration, General Session, and all Food Functions and Special Events

Silver Sponsor: $3,000 +

    • 1 Complimentary Registration to the ITherm conference
    • 1 Half Page Acknowledgment as a Silver Sponsor in the Final Program
    • 1 Page of promotional materials distributed at registration and integrated into the USB stick Proceedings, with a link to your corporate website
    • Acknowledgment on the conference website with a link to your corporate website
    • Signage throughout the conference venue acknowledging you as a Silver Sponsor. Specific areas include: Hotel Lobby, Registration, General Session, and all Food Functions and Special Events

Exhibitor: $3,000 +

    • 8’x 8’ space to setup booth
    • 6’ table to distribute flyers/materials in the Foyer
    • Two free exhibitor pass (not eligible for conference sessions, breakfast and lunch)
    • 25% discount on full registration (limited to 3 persons affiliated with the company, eligible for conference sessions, breakfast and lunch)
    • 1 Half Page Acknowledgment as an Exhibitor in the Final Program
    • 1 Page of promotional materials distributed at registration and integrated into the USB stick Proceedings, with a link to your corporate website
    • Acknowledgment on the conference website with a link to your corporate website
    • Signage throughout the conference venue acknowledging you as an Exhibitor. Specific areas include: Hotel Lobby, Registration, General Session, and all Food Functions and Special Events

OUR GOLD SPONSORS for 2016:

Intel Corp.
Intel Corporation

Binghamton University
Binghamton University S3IP Center
 

microsanj
Microsanj
 

OUR SILVER SPONSORS for 2016:


IBM Corp.
IBM Corp.

Huawei Technologies Co.
Huawei Technologies Co.

OUR EXHIBITORS for 2016:


Innovative Research, LLC
Innovative Research, LLC

MacroFlowTM – A Software Tool for Rapid Thermal Design of Electronics Cooling Systems

MacroFlow is an easy-to-use software tool based on the Flow Network Modeling (FNM) technique for rapid and accurate system-level thermal design. MacroFlow has an intuitive GUI, an extensive library of components with built-in correlations and vendor data, a powerful solution methodology, and comprehensive capabilities for examining results. Use of MacroFlow for flow and thermal design results in substantially shorter design cycles. It is widely used for the design of air- and liquid-cooling systems in computer, telecom, defense, data center, and semiconductor processing applications.


World Scientific Publishing
World Scientific Publishing is a leading independent publisher of books and journals for the scholarly, research and professional communities. The company publishes about 600 books annually and about 130 journals in various fields. World Scientific collaborates with prestigious organisations like the Nobel Foundation, US National Academies Press, as well as its subsidiary, the Imperial College Press, amongst others, to bring high quality academic and professional content to researchers and academics worldwide. World Scientific is growing its publishing programme in electronics and thermal packaging. Please send all queries to Jason Lim.


Stäubli North America
Stäubli North America

Stäubli’s quick-release couplings contribute to an improved cooling circuit from the main supply to the various racks. Staubli technology ensures the optimum sealing of your circuits. The all-metallic flush-face connectors enable non-spill connections and disconnections with complete safety throughout the processes. With Stäubli solutions, the link between cooling liquids and electronics improves overall performance. Whatever the application, the fluid composition, or the circuit configuration, Stäubli provides a solution to fit your needs.

Visit ANSYS to learn about the advanced Chip-Package-System (CPS) workflow for the design of electronic devices. This multiphysics flow provides automated electromagnetic-thermal-mechanical analysis of printed circuit boards and electronic packages to determine stresses, deformation and fatigue failures caused by high power densities. With ANSYS CPS you can avoid potential failures in your electronic systems designs due to thermal and mechanical loading due to steadily increasing power dissipation combined with smaller board sizes.



QFI and TMX demonstrate an innovative, integrated temperature mapping system that combines the versatility of the Infrared InfraScope™ and the deep-submicron resolution of the Thermoreflectance T°Imager™. With a single integrated system, the analyst can map the temperature fields of active devices from the macro- to the nano-scales without disturbing the device under test. It can switch measurement physics and vary the wavelength of light to handle the full range of materials used in microelectronic devices.



TMX Scientific provides thermoreflectance-based systems and advanced software programs to propel innovation, shorten design cycle time, and troubleshoot thermal challenges in the microelectronics industry. TMX Scientific’s fast and accurate instruments utilize a fully optical, non-destructive approach to measure thermal fields at submicron resolution with the T°Imager™ and material thermal properties of thin-film layers with the Transometer™. The company also offers computational applications that enable pixel-perfect temperature differential maps and statistics-driven filtering as well as self-adaptive, full-physics thermal simulations for analyzing and designing complex microelectronic structures.


Since 1985, Long Win has specialized in research, design, manufacture and service of scientific instruments for thermal management, material & fluid mechanics and educational fields. Long Win holds a leading position on research, measurement and inspection apparatus for the electronic cooling industry. Some of their product lines include thermal-related measurement apparatus for fan performance (automated airflow benches based on AMCA 210 standard), TIMs (Thermal resistance and conductivity measurement), cooler modules, heat pipes, vapor chambers, IC packages, LEDs, and natural-convection simulation. They have more than 100 types of apparatus in their 18,000 sq. ft. lab which is located in Taiwan. Long Win’s thermal lab is going to be launched in California later in 2016.

The ITherm/ECTC exhibits will be open on Wednesday June 1, from 9:00 AM – Noon and 1:30 PM – 6:30 PM; and again on Thursday June 2, 9:00 AM – Noon and 1:30 PM – 4:00 PM.
We are pleased to welcome these exhibitors with specific focus on thermal design/modeling/practice.
Review all 100+ Exhibitors who’ll be at ITherm/ECTC in Las Vegas (For a full list of exhibitors, and an Exhibitor Packet, please visit www.ectc.net/exhibitors).

Other Opportunities

We invite you to discuss with our Conference team the other sponsorship opportunities we have.