WELCOME TO ITHERM 2017
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems
May 30 – June 2, 2017 • Walt Disney World Swan & Dolphin Hotel, Lake Buena Vista (Orlando), FL USA
(Co-Located with ECTC)
Sponsored by the IEEE’s CPMT Society and of course TFIA, ITherm 2017 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2017 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2017 includes panel discussions, keynote lectures by prominent speakers, Technical Talks, a Student Poster and Networking Session, and professional short courses.
We invite you to register for ITherm 2017. You may register on our Cvent website, which opens in December. More details on our Registration Page.
Advance Program for 2016 (last year)
|Abstract Submission Deadline||August 25, 2016|
|Notification of Acceptance||September 30, 2016|
|Draft Student-Grant paper Due||December 20, 2016|
|Draft paper Due||December 20, 2016|
|Paper Reviews Returned by||February 6, 2017|
|Final Version of Paper Due||March 13, 2017|
|Author Registration Due||March 13, 2017|
|Hotel Registration Deadline||May 1, 2017|
|Earlybird Registration Deadline||May 5, 2017|
|Conference||May 30 – June 2, 2017|
To receive periodic announcements about ITHERM, please join our IEEE ListServ Dlist. You may also join by email:[email protected] with this information in the BODY: subscribe ieee-itherm FirstName LastName.