The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems

May 31 – June 3, 2016 • Cosmopolitan Hotel, Las Vegas, NV, USA
(Co-Located with ECTC)

Please download the Full Advance Program today.   Registration is now open; once you are registered, we can provide a Visa Interview letter, to assist in your travels to the USA.

Sponsored by the IEEE’s CPMT Society, ITherm 2016 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount.  In addition to Oral and poster presentations and vendor exhibits, ITherm 2016 includes panel discussions, keynote lectures by prominent speakers, a “Cutting Edge Vendors” session, a Workshop on the Industrial Internet, and professional short courses.

We invite you to register for ITherm 2016. You may register on our Cvent website, www.cvent.com/d/2fq1ck, now open. More details on our Registration Page.

View the
Advance Program for 2016
Our Sponsors: Binghamton University, Microsanj, IBM, Huawei, and Intel
Joint ITherm/ECTC
Professional Development Courses
Our Exhibitors: Long Win Science & Technology, TMX Scientific, Inc., ANSYS Corp, Staubli North America, Innovative Research, LLC, Quantum Focus Instruments, World Scientific Publishing
Tech Talks on critical topics: Aerospace Thermal Management; ICE-Cool: Intrachip/Interchip Enhanced Cooling; Advanced Cooling Solutions for Photonics; Embedded Inter/Intra-chip Cooling I & II; Microfluidics
Panels: LED Packaging; Thermal Issues for Mobile Devices; Micro-Two-Phase Liquid Cooling Systems; Design Challenges in Internet of Things (IoT); X-ray Characterization of Highly Conductive Materials; Data Centers and Emerging Technologies

Important Dates:

Abstract Submission Deadline September 4 September 30, 2015
Notification of Acceptance October 2, 2015
Draft Student-Grant paper Due December 4, 2015
Draft paper Due December 31, 2015
Final Version of Paper Due March 14, 2016
Author Registration Due March 28, 2016
Hotel Registration Deadline May 1, 2016
Earlybird Registration Deadline May 5, 2016
Conference May 31 – June 3, 2016

To receive periodic announcements about ITHERM, please join our IEEE ListServ Dlist.     You may also join by email:listserv@listserv.ieee.org with this information in the BODY:     subscribe   ieee-itherm  FirstName   LastName.

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