WELCOME TO ITHERM 2016
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems
May 31 – June 3, 2016 • Cosmopolitan Hotel, Las Vegas, NV, USA
(Co-Located with ECTC)
Please download the Full Advance Program or the Advance Technical Program today. Registration is now open; once you are registered, we can provide a Visa Interview letter, to assist in your travels to the USA.
Sponsored by the IEEE’s CPMT Society, ITherm 2016 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2016 includes panel discussions, keynote lectures by prominent speakers, a “Cutting Edge Vendors” session, a Workshop on the Industrial Internet, and professional short courses.
Advance Program for 2016
Professional Development Courses
the Industrial Internet
|Abstract Submission Deadline||September 4 September 30, 2015|
|Notification of Acceptance||October 2, 2015|
|Draft Student-Grant paper Due||December 4, 2015|
|Draft paper Due||December 31, 2015|
|Final Version of Paper Due||March 14, 2016|
|Author Registration Due||March 28, 2016|
|Hotel Registration Deadline||May 1, 2016|
|Earlybird Registration Deadline||May 5, 2016|
|Conference||May 31 – June 3, 2016|
To receive periodic announcements about ITHERM, please join our IEEE ListServ Dlist. You may also join by email:firstname.lastname@example.org with this information in the BODY: subscribe ieee-itherm FirstName LastName.