WELCOME TO ITHERM 2016
The Intersociety Conference on Thermal and
Thermomechanical Phenomena in Electronic Systems
May 31 – June 3, 2016 • Cosmopolitan Hotel, Las Vegas, NV, USA
(Co-Located with ECTC)
Abstracts are due by September 4, 2015. Download the 2016 Call for Papers today!
Sponsored by the IEEE’s CPMT Society, ITherm 2016 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2016 includes panel discussions, keynote lectures by prominent speakers, a “Cutting Edge Vendors” session, a Workshop on the Industrial Internet, and professional short courses.
Final Program from 2014
Tech Talks (DARPA Gen-3)
Professional Development Courses
the Industrial Internet
|Abstract Submission Deadline||September 4, 2015|
|Notification of Acceptance||October 2, 2015|
|Draft Student-Grant paper Due||December 4, 2015|
|Draft paper Due||December 4, 2015|
|Final Version of Paper Due||March 14, 2016|
|Author Registration Due||March 28, 2016|
|Hotel Registration Deadline||May 1, 2016|
|Regular Registration Deadline||May 15, 2016|
|Conference||May 31 – June 3, 2016|
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